Supplier🇨🇭 Switzerland
Hilpert electronics AG
Tenders published
0
Contracts won
2
Latest contracts won
AwardedIndustrial goods & machinery🇩🇪 GermanyTED
High Precision bonder for wafer and chiplet level assembly (IZM-01) - PR915599-2590-P
Fraunhofer-Gesellschaft - Einkauf B12
Published 8 Jul 2025
2 lots won · total · 1 tenders received
Usual buyers
Sectors
- Industrial goods & machinery2